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| 论文题目: | thermal analysis of high-power light-emitting diode using thermoreflectance thermography |
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| 作者: | 王大正、郑利兵、司维康、杨鹤、高莹莹 |
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| 刊物名称: | 2021 22nd international conference on electronic packaging technology (icept) |
| 年: | 2021 |
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thermal analysis of high-power light-emitting diode using thermoreflectance thermography