| 论文编号: | |
| 第一作者所在部门: | |
| 论文题目: | study on thermal expansion based on ccd thermoreflectance imaging technology |
| 论文题目英文: | |
| 作者: | he yang,dazheng wang,qiyan yin,yingying gao,libing zheng |
| 论文出处: | |
| 刊物名称: | 2021 22nd international conference on electronic packaging technology (icept) |
| 年: | 2022 |
| 卷: | |
| 期: | |
| 页: | |
| 联系作者: | |
| 收录类别: | |
| 影响因子: | |
| 摘要: | |
| 英文摘要: | |
| 外单位作者单位: | |
| 备注: | |
study on thermal expansion based on ccd thermoreflectance imaging technology